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MPC566MVR56

32-BIT, FLASH, 56MHz, RISC MICROCONTROLLER, PBGA388, 27 X 27 MM, 1 MM PITCH, PLASTIC, MO-151AAL-1, BGA-388

器件类别:嵌入式处理器和控制器    微控制器和处理器   

厂商名称:FREESCALE (NXP)

器件标准:  

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器件参数
参数名称
属性值
是否无铅
不含铅
是否Rohs认证
符合
Objectid
2069912817
零件包装代码
BGA
包装说明
27 X 27 MM, 1 MM PITCH, PLASTIC, MO-151AAL-1, BGA-388
针数
388
Reach Compliance Code
compliant
ECCN代码
3A991.A.2
Samacsys Manufacturer
NXP
Samacsys Modified On
2022-12-27 12:55:46
具有ADC
NO
其他特性
ALSO REQUIRES 5V SUPPLY
地址总线宽度
24
位大小
32
最大时钟频率
84 MHz
DAC 通道
NO
DMA 通道
NO
外部数据总线宽度
32
JESD-30 代码
S-PBGA-B388
JESD-609代码
e1
长度
27 mm
湿度敏感等级
3
I/O 线路数量
端子数量
388
片上程序ROM宽度
8
最高工作温度
125 °C
最低工作温度
-40 °C
PWM 通道
YES
封装主体材料
PLASTIC/EPOXY
封装代码
BGA
封装形状
SQUARE
封装形式
GRID ARRAY
峰值回流温度(摄氏度)
260
认证状态
Not Qualified
ROM(单词)
1048576
ROM可编程性
FLASH
座面最大高度
2.55 mm
速度
56 MHz
最大供电电压
2.7 V
最小供电电压
2.5 V
标称供电电压
2.6 V
表面贴装
YES
技术
CMOS
温度等级
AUTOMOTIVE
端子面层
TIN SILVER COPPER
端子形式
BALL
端子节距
1 mm
端子位置
BOTTOM
处于峰值回流温度下的最长时间
40
宽度
27 mm
uPs/uCs/外围集成电路类型
MICROCONTROLLER, RISC
文档预览
MPC565 Reference Manual
Additional Devices Supported:
MPC566
MPC565RM
REV 2.2
11/2005
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© Freescale Semiconductor, Inc. 2004, 2005. All rights reserved.
MPC565RM
REV 2.2
11/2005
Contents
Paragraph
Number
Title
Page
Number
About This Book
Audience ...................................................................................................................... xxxix
Organization................................................................................................................. xxxix
Suggested Reading............................................................................................................ xli
Conventions and Nomenclature....................................................................................... xlii
Notational Conventions .................................................................................................. xliii
Acronyms and Abbreviations ......................................................................................... xliv
References........................................................................................................................ xlv
Chapter 1
Overview
1.1
1.2
1.3
1.3.1
1.3.2
1.3.3
1.3.4
1.3.5
1.3.6
1.3.7
1.3.8
1.3.9
1.3.10
1.3.10.1
1.3.10.2
1.3.11
1.3.11.1
1.3.11.2
1.3.12
1.3.13
1.3.14
1.4
1.5
1.6
1.7
1.8
1.9
Introduction ..................................................................................................................... 1-1
Block Diagram ................................................................................................................ 1-2
Detailed Feature List ....................................................................................................... 1-3
High Performance CPU System ................................................................................. 1-3
RISC MCU Central Processing Unit (RCPU) ............................................................ 1-3
MPC500 System Interface (USIU) ............................................................................. 1-4
Burst Buffer Controller (BBC) Module ...................................................................... 1-4
Flexible Memory Protection Unit ............................................................................... 1-4
Memory Controller ..................................................................................................... 1-5
1 Mbyte of CDR3 Flash EEPROM Memory (UC3F) ................................................ 1-5
36-Kbyte Static RAM (CALRAM) ............................................................................ 1-5
General Purpose I/O Support (GPIO) ......................................................................... 1-5
Debug Features ........................................................................................................... 1-6
Nexus Debug Port (Class 3) ................................................................................... 1-6
Data Link Controller (DLCMD2) Module ............................................................. 1-6
Integrated I/O System ................................................................................................. 1-7
Time Processor Units (TPU3) ................................................................................ 1-7
22-Channel Modular I/O System (MIOS14) .......................................................... 1-7
Two Enhanced Queued Analog-to-Digital Converter Modules (QADC64E) ............ 1-7
Three CAN 2.0B Controller (TouCAN) Modules ...................................................... 1-8
Queued Serial Multi-Channel Modules (QSMCM) .................................................... 1-8
MPC565 Optional Features ............................................................................................ 1-9
Differences between the MPC565 and the MPC555 ...................................................... 1-9
Additional MPC565 Differences .................................................................................. 1-10
SRAM Keep-Alive Power Behavior ............................................................................. 1-11
MPC565 Memory Map ................................................................................................. 1-11
MPC565 Pinout Diagram .............................................................................................. 1-14
MPC565 Reference Manual, REV 2.2
Freescale Semiconductor
iii
Contents
Paragraph
Number
Title
Page
Number
Chapter 2
Signal Descriptions
2.1
2.2
2.2.1
2.3
2.4
2.4.1
2.4.2
2.5
2.5.1
2.5.2
2.5.3
2.5.4
2.5.4.1
2.5.4.2
2.5.4.3
2.5.4.4
2.5.5
Signal Groupings ............................................................................................................ 2-1
Signal Summary .............................................................................................................. 2-3
MPC565 Signal Multiplexing ................................................................................... 2-22
Pad Module Configuration Register (PDMCR) ............................................................ 2-22
Pad Module Configuration Register (PDMCR2) .......................................................... 2-24
JTAG / BDM ............................................................................................................ 2-25
QSMCM and DLCMD2 (J1850) Modules ............................................................... 2-25
Reset State ..................................................................................................................... 2-26
Signal Functionality Configuration Out of Reset ..................................................... 2-26
Signal State During Reset ......................................................................................... 2-26
Power-On Reset and Hard Reset .............................................................................. 2-27
Pull-Up/Pull-Down ................................................................................................... 2-27
Pull-Up/Pull-Down Enable and Disable for 5-V Only and 2.6-V Only Signals .. 2-27
Pull-Down Enable and Disable for 5-V/2.6-V Multiplexed Signals .................... 2-27
Special Pull Resistor Disable Control Functionality (SPRDS) ............................ 2-27
Pull Device Select (PULL_SEL) .......................................................................... 2-27
Signal Reset States .................................................................................................... 2-28
Chapter 3
Central Processing Unit
3.1
3.2
3.3
3.4
3.4.1
3.4.2
3.4.3
3.4.4
3.5
3.6
3.7
3.7.1
3.7.2
3.7.3
3.7.4
3.7.4.1
3.7.4.2
RCPU Block Diagram .................................................................................................... 3-1
RCPU Key Features ........................................................................................................ 3-3
Instruction Sequencer ..................................................................................................... 3-3
Independent Execution Units .......................................................................................... 3-4
Branch Processing Unit (BPU) ................................................................................... 3-5
Integer Unit (IU) ......................................................................................................... 3-5
Load/Store Unit (LSU) ............................................................................................... 3-6
Floating-Point Unit (FPU) .......................................................................................... 3-6
Levels of the PowerPC ISA Architecture ....................................................................... 3-6
RCPU Programming Model ............................................................................................ 3-7
User Instruction Set Architecture (UISA) Register Set ................................................ 3-12
General-Purpose Registers (GPRs) ........................................................................... 3-12
Floating-Point Registers (FPRs) ............................................................................... 3-12
Floating-Point Status and Control Register (FPSCR) .............................................. 3-13
Condition Register (CR) ........................................................................................... 3-16
Condition Register CR0 Field Definition ............................................................. 3-17
Condition Register CR1 Field Definition ............................................................. 3-17
MPC565 Reference Manual, REV 2.2
Freescale Semiconductor
iv
Contents
Paragraph
Number
3.7.4.3
3.7.5
3.7.6
3.7.7
3.8
3.9
3.9.1
3.9.2
3.9.3
3.9.4
3.9.5
3.9.6
3.9.7
3.9.8
3.9.9
3.9.10
3.9.10.1
3.9.10.2
3.9.10.3
3.10
3.10.1
3.10.2
3.10.3
3.11
3.11.1
3.11.2
3.11.3
3.11.4
3.11.5
3.12
3.13
3.13.1
3.13.2
3.13.3
3.13.4
3.13.5
3.13.6
3.13.7
3.13.7.1
3.13.7.2
3.13.8
Title
Page
Number
Condition Register CRn Field — Compare Instruction ....................................... 3-17
Integer Exception Register (XER) ............................................................................ 3-18
Link Register (LR) .................................................................................................... 3-19
Count Register (CTR) ............................................................................................... 3-19
VEA Register Set — Time Base (TB) .......................................................................... 3-20
OEA Register Set .......................................................................................................... 3-20
Machine State Register (MSR) ................................................................................. 3-20
DAE/Source Instruction Service Register (DSISR) ................................................. 3-22
Data Address Register (DAR) .................................................................................. 3-23
Time Base Facility (TB) — OEA ............................................................................. 3-23
Decrementer Register (DEC) .................................................................................... 3-23
Machine Status Save/Restore Register 0 (SRR0) ..................................................... 3-23
Machine Status Save/Restore Register 1 (SRR1) ..................................................... 3-23
General SPRs (SPRG0–SPRG3) .............................................................................. 3-24
Processor Version Register (PVR) ........................................................................... 3-25
Implementation-Specific SPRs ................................................................................. 3-25
EIE, EID, and NRI Special-Purpose Registers ..................................................... 3-25
Floating-Point Exception Cause Register (FPECR) ............................................. 3-26
Additional Implementation-Specific Registers ..................................................... 3-26
Instruction Set ............................................................................................................... 3-27
Instruction Set Summary .......................................................................................... 3-28
Recommended Simplified Mnemonics ..................................................................... 3-33
Calculating Effective Addresses ............................................................................... 3-34
Exception Model ........................................................................................................... 3-34
Exception Classes ..................................................................................................... 3-35
Ordered Exceptions ................................................................................................... 3-35
Unordered Exceptions ............................................................................................... 3-35
Precise Exceptions .................................................................................................... 3-36
Exception Vector Table ............................................................................................ 3-36
Instruction Timing ........................................................................................................ 3-37
User Instruction Set Architecture (UISA) .................................................................... 3-39
Computation Modes .................................................................................................. 3-39
Reserved Fields ......................................................................................................... 3-39
Classes of Instructions .............................................................................................. 3-39
Exceptions ................................................................................................................. 3-40
Branch Processor ...................................................................................................... 3-40
Instruction Fetching .................................................................................................. 3-40
Branch Instructions ................................................................................................... 3-40
Invalid Branch Instruction Forms ......................................................................... 3-40
Branch Prediction ................................................................................................. 3-40
Fixed-Point Processor ............................................................................................... 3-40
MPC565 Reference Manual, REV 2.2
Freescale Semiconductor
v
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参数对比
与MPC566MVR56相近的元器件有:MPC566AZP56、MPC566CVR56、MPC565CZP40、MPC565CZP56、MPC565CVR56、MPC566MZP56、MPC566CZP56、MPC565MVR56、MPC565MZP56。描述及对比如下:
型号 MPC566MVR56 MPC566AZP56 MPC566CVR56 MPC565CZP40 MPC565CZP56 MPC565CVR56 MPC566MZP56 MPC566CZP56 MPC565MVR56 MPC565MZP56
描述 32-BIT, FLASH, 56MHz, RISC MICROCONTROLLER, PBGA388, 27 X 27 MM, 1 MM PITCH, PLASTIC, MO-151AAL-1, BGA-388 32-bit microcontrollers - mcu mpc566 1024kflsh qorivva 32-bit microcontrollers - mcu mpc566 1024kflash qorivva 32-bit microcontrollers - mcu mpc565 1024kflash qorivva 32-bit microcontrollers - mcu mpc565 1024kflash qorivva 32-bit microcontrollers - mcu mpc565 1024kflash qorivva 32-bit microcontrollers - mcu mpc566 1024kflsh qorivva 32-bit microcontrollers - mcu mpc566 1024kflsh qorivva 32-bit microcontrollers - mcu mpc565 1024kflash qorivva 32-bit microcontrollers - mcu mpc565 1024kflash qorivva
Manufacture - Freescale Semiconduc Freescale Semiconduc Freescale Semiconduc Freescale Semiconduc Freescale Semiconduc Freescale Semiconduc Freescale Semiconduc Freescale Semiconduc -
产品种类
Product Category
- 32-bit Microcontrollers - MCU 32-bit Microcontrollers - MCU 32-bit Microcontrollers - MCU 32-bit Microcontrollers - MCU 32-bit Microcontrollers - MCU 32-bit Microcontrollers - MCU 32-bit Microcontrollers - MCU 32-bit Microcontrollers - MCU -
RoHS - N Yes N N Yes N N Yes -
A/D Bit Size - 10 bi 10 bi 10 bi 10 bi 10 bi 10 bi 10 bi 10 bi -
Core - MPC500 MPC500 MPC500 MPC500 MPC500 MPC500 MPC500 MPC500 -
Data Bus Width - 32 bi 32 bi 32 bi 32 bi 32 bi 32 bi 32 bi 32 bi -
Maximum Clock Frequency - 56 MHz 56 MHz 56 MHz 40 MHz 56 MHz 56 MHz 56 MHz 56 MHz -
Program Memory Size - 1 MB 1 MB 1 MB 1 MB 1 MB 1 MB 1 MB 1 MB -
Data RAM Size - 36 kB 36 kB 36 kB 36 kB 36 kB 36 kB 36 kB 36 kB -
On-Chip ADC - N N N N N N N N -
工作电源电压
Operating Supply Voltage
- 2.6 V, 5 V 2.6 V, 5 V 2.6 V, 5 V 2.6 V, 5 V 2.6 V, 5 V 2.6 V, 5 V 2.6 V, 5 V 2.6 V, 5 V -
最大工作温度
Maximum Operating Temperature
- + 125 C + 85 C + 85 C + 85 C + 85 C + 125 C + 85 C + 85 C -
封装 / 箱体
Package / Case
- BGA-388 BGA-388 BGA-388 BGA-388 BGA-388 BGA-388 BGA-388 BGA-388 -
安装风格
Mounting Style
- SMD/SMT SMD/SMT SMD/SMT SMD/SMT SMD/SMT SMD/SMT SMD/SMT SMD/SMT -
A/D Channels Available - 40 40 40 40 40 40 40 40 -
接口类型
Interface Type
- QSPI, SCI, UART QSPI, SCI, UART QSPI, SCI, UART QSPI, SCI, UART QSPI, SCI, UART QSPI, SCI, UART QSPI, SCI, UART QSPI, SCI, UART -
最小工作温度
Minimum Operating Temperature
- - 55 C - 40 C - 40 C - 40 C - 40 C - 40 C - 40 C - 40 C -
Number of Programmable I/Os - 56 56 56 56 56 56 56 22 -
Number of Timers - 3 3 3 3 3 3 3 3 -
系列
Packaging
- Tray Tray Tray Tray Tray Tray Tray Tray -
Processor Series - MPC5xx MPC5xx MPC5xx MPC5xx MPC5xx MPC5xx MPC5xx MPC5xx -
Program Memory Type - Flash Flash Flash Flash Flash Flash Flash Flash, SRAM -
工厂包装数量
Factory Pack Quantity
- 40 40 40 40 40 40 40 200 -
Unit Weigh - 2.451 g 2.407 g 2.451 g 2.451 g 2.407 g 2.451 g 2.451 g 2.407 g -
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器件捷径:
A0 A1 A2 A3 A4 A5 A6 A7 A8 A9 AA AB AC AD AE AF AG AH AI AJ AK AL AM AN AO AP AQ AR AS AT AU AV AW AX AY AZ B0 B1 B2 B3 B4 B5 B6 B7 B8 B9 BA BB BC BD BE BF BG BH BI BJ BK BL BM BN BO BP BQ BR BS BT BU BV BW BX BY BZ C0 C1 C2 C3 C4 C5 C6 C7 C8 C9 CA CB CC CD CE CF CG CH CI CJ CK CL CM CN CO CP CQ CR CS CT CU CV CW CX CY CZ D0 D1 D2 D3 D4 D5 D6 D7 D8 D9 DA DB DC DD DE DF DG DH DI DJ DK DL DM DN DO DP DQ DR DS DT DU DV DW DX DZ
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